YCS CPU REBALLING PLATFORM FOR PHONE IC SOLDERING TIN PLANTING

YCS Repairer CPU Magnet Reballing U Platform for CPU, Qualcomm, HiSilicon, MediaTek and Samsung CPU Tin Planting Glue Removal Repair. YCS CPU reballing platform for mobile phone CPU chip soldering repair.

Features:
1. Tight clamping, precise clamping, more stable operation, less likely to damage the chip.
2. High temperature and corrosion resistance, high quality synthetic stone, high strength, anti-fouling and easy to clean.
3. Glue removal, tin implantation, U protection, a good machine multi-purpose, magnetic design, stable and firm, high temperature resistance, durable.
4. Anti-slip rubber foot pads, wear-resistant and anti-slip, enhanced stability, easier maintenance.

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