YCS H03 MAX HOLDER FIXTURE FOR MOTHERBOARD / CPU / IC

YCS-H03 MAX Universal Motherboard Chip Ring Fixture for Mobile Phone Soldering Repair

Features:
Larger size, more clamping space, fully applicable to various types of chips/motherboards
Removal of tin and glue, no need to adjust the direction, travel coaxial movement
For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife
Motherboard cleaning doesn’t require adjusting the orientation, clean up at once
The module is suitable for various sizes of motherboards in all aspects

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